1/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. cmos ldo regulators fo r portable equipments 1ch 150ma cmos ldo regulators bh rb1wgut series description the bh rb1wgut series is a line of 150 ma output cmos regulator s that deliver a highly stable precision ( 1%) output voltage. proprietary rohm technology enables a small l oad regulation of 2 mv and a dropout voltage of 100 mv. at just 1.0 mm ? 1.04 mm, the new vcsp60n1 package is extremely co mpact, and the ic's enhanced protection circuits contribute to improved end products characteristics. features 1) high accuracy output voltage: 1% 2) dropout voltage: 100 mv (at 100 ma) 3) stable with ceramic capacitors 4) low bias current: 34 a 5) high ripple rejection ratio: 63 db (typ., 1 khz) 6) output voltage on/off control 7) built-in overcurrent and thermal shutdown circuits 8) vcsp60n1 wl-csp package : (1.0 1.04 0.6mm) applications battery-driven portable devices, etc. product line ? 150 ma bh rb1wgut series product name 1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3 package bh rb1wgut vcsp60n1 model name: bh rb1w a b symbol description a output voltage specification output voltage (v) output voltage (v) 15 1.5 v (typ.) 29 2.9 v (typ.) 18 1.8 v (typ.) 30 3.0 v (typ.) 25 2.5 v (typ.) 31 3.1 v (typ.) 28 2.8 v (typ.) 33 3.3 v (typ.) b package gut: vcsp60n1 no.11020ect03
bh rb1wgut series technical note 2/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. absolute maximum ratings parameter symbol ratings unit applied supply voltage vmax -0.3 to +6.5 v power dissipation pd 530 *1 mw operating temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c *1: reduce by 5.3 mw/ ? c over 25 ? c, when mounted on a glass epoxy pcb (7 mm ? 7 mm ? 0.8 mm). recommended operating ranges (not to exceed pd) parameter symbol ratings unit power supply voltage v in 2.5 to 5.5 v output current iout 0 to 150 ma recommended operating conditions parameter symbol ratings unit conditions min. typ. max. input capacitor c in 0.7 *2 1.0 ? f the use of ceramic capacitors is recommended. output capacitor c o 0.7 *2 1.0 ? f the use of ceramic capacitors is recommended. *2: make sure that the output capacitor va lue is not kept lower than this specified level across a variety of temperature, dc b ias characteristic. and also make sure that the capacitor value cannot change as time progresses. electrical characteristics (unless otherwise specified, ta = 25c, v in = v out + 1.0 v *5 , stby = 1.5 v, c in = 1 f, c o = 1 f) parameter symbol limits unit conditions min. typ. max. output voltage 1 v out 1 v out ? 0.99 v out v out ? 1.01 v i out = 1 ma, ta = 25c, bh25rb1wgut or higher v out - 25 mv v out + 25 mv i out = 1ma, ta = 25c, bh15, 18rb1wgut output voltage 2 v out 2 v out ? 0.97 v out v out ? 1.03 v i out = 1 ma ta = -40c to 85c *3 circuit current ignd ? 34 72 a i out = 0 ma ta = -40c to 85c *3 circuit current (stby) iccst ? ? 1.0 a stby = 0 v ripple rejection ratio rr ? 63 ? db vrr = -20 dbv, frr = 1 khz, i out = 10 ma dropout voltage vsat ? 100 150 mv v in = 0.98 ? v out , i out = 100 ma (excluding bh15, 18rb1wgut) line regulation vdli ? 2 20 mv i out = 10 ma v in = v out + 0.5 v to 5.5 v *4 load regulation vdlo ? 2 30 mv i out = 1 ma to 100 ma overcurrent protection limit current ilmax ? 300 ? ma v o = v out ? 0.98 short current ishort ? 40 ? ma v o = 0 v stby pin current istby 0.5 1. 3 3.6 a ta = -40c to 85c *3 stby control voltage on vstbh 1.2 ? v in v ta = -40c to 85c *3 off vstbl -0.2 ? 0.2 v ta = -40c to 85c *3 * this ic is not designed to be radiation-resistant. *3: these specifications are guaranteed by design. *4: for bh15, 18rb1wgut, vin = 3.0 v to 5.5 v. *5: for bh15, 18rb1wgut, vin = 3.5 v.
bh rb1wgut series technical note 3/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. typical characteristics fig. 1 output voltage vs input voltage (bh15rb1wgut) fig. 2 output voltage vs input voltage (bh28rb1wgut) fig. 3 output voltage vs input voltage (bh33rb1wgut) fig. 4 gnd current vs input voltage (bh15rb1wgut) fig. 5 gnd current vs input voltage (bh28rb1wgut) fig. 6 gnd current vs input voltage (bh33rb1wgut) fig. 7 output voltage vs output current (bh15rb1wgut) fig. 8 output voltage vs output current (bh28rb1wgut) fig. 9 output voltage vs output current (bh33rb1wgut) fig. 10 dropout voltage vs output current (bh28rb1wgut) fig. 11 dropout voltage vs output current (bh33rb1wgut) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 01 23 45 input voltag e vin[v] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 01 23 45 input voltag e vin[v] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 input voltag e vin[v] output voltage vout[v] 0 10 20 30 40 50 60 01 23 45 input voltag e vin[v] gnd current ignd[a] 0 10 20 30 40 50 60 01 23 45 input voltag e vin[v] gnd current ignd[a] 0 10 20 30 40 50 60 01 23 45 input voltag e vin[v] gnd current ignd[a] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 output current iout[ma] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 output current iout[ma] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 output current iout[ma] output voltage vout[v] 0 50 100 150 200 0 50 100 150 output current iout[ma] dropout voltage vsat[v] 0.0 0.1 0.2 0.3 0.4 0.5 0 50 100 150 output current iout[ma] dropout voltage vsat[v]
bh rb1wgut series technical note 4/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. fig. 12 output voltage vs temperature (bh15rb1wgut) fig. 13 output voltage vs temperature (bh28rb1wgut) fig. 14 output voltage vs temperature (bh33rb1wgut) fig. 15 ripple rejection (bh15rb1wgut) fig. 16 ripple rejection (bh28rb1wgut) fig. 17 ripple rejection (bh33rb1wgut) 10 20 30 40 50 60 70 80 fr eq uency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 k 1m 10 20 30 40 50 60 70 80 fr eq uency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 k 1m 10 20 30 40 50 60 70 80 fr eq uency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 k 1m fig. 18 load response (co = 1.0 f) (bh15rb1wgut) iout = 1 ma 30 ma fig. 19 load response (co = 1.0 f) (bh28rb1wgut) iout = 1 ma 30 ma fig, 20 load response (co = 1.0 f) (bh33rb1wgut) fig. 23 output voltage rise time (bh33rb1wgut) co=1.0 f io=10ma co=1.0 f io=10ma co=1.0 f io=10ma vout 50 mv/div 50 s/div vout 50 mv/div 50 s/div iout = 1 ma 30 ma vout 50 mv/div 50 s/div stby vout 1 v/div 100 s/div 1 v/div co = 1 f co = 2.2 f r l = 3.3 k ? stby vout 1 v/div 100 s/div 1 v/div co = 1 f co = 2.2 f fig. 22 output voltage rise time (bh28rb1wgut) r l = 2.8 k ? fig. 21 output voltage rise time (bh15rb1wgut) stby vout 1 v/div 100 s/div 1 v/div co = 1 f co = 2.2 f r l = 1.5 k ? 1.40 1.45 1.50 1.55 1.60 -50 -25 0 25 50 75 100 temp[ ] output voltage vout[v] iout=1ma 2.70 2.75 2.80 2.85 2.90 -50 -25 0 25 50 75 100 temp[ ] output voltage vout[v] iout=1ma 3.20 3.25 3.30 3.35 3.40 - 50 - 25 0 25 50 75 100 temp[ ] output voltage vout[v] iout=1ma
bh rb1wgut series technical note 5/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. block diagram, recommended circuit diagram, and pin assignment diagram power dissipation (pd) 1. power dissipation (pd) power dissipation calculations include output power dissipati on characteristics and internal ic power consumption. in the event that the ic is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circ uit, reducing the current capacity and otherwise degrading the ic's design performance. allow for sufficient margins so that this power dissipation is not exceeded during ic operation. calculating the maximum internal ic power consumption (p max ) p max = (v in - v out ) ? i out (max.) v in : input voltage v out : output voltage i out (max): output current 2. power dissipation/power dissipation reduction (pd) vcsp60n1 *circuit design should allow a sufficient margin for the temperature range for pmax < pd. fig. 25 vcsp60n1 power dissipation/power dissipation reduction (example) input output capacitors it is recommended to insert bypass capacitors between input and gnd pins, positioning them as close to the pins as possible. these capacitors are used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the ic has been mounted. cera mic capacitors generally have temperature and dc bias characteristics. use x5r or x7r ceramic capacitors, which offer good temperature and dc bias characteristics as well as stable high voltages. typical ceramic capacitor characteristics pin no. symbol function b2 v in power supply input b1 v out voltage output a1 gnd ground a2 stby output voltage on/off control (high: on, low: off) 0 20 40 60 80 100 120 01234 dc bias vdc (v) capacitance rate of change (%)] 70 75 80 85 90 95 100 01234 dc bias vdc (v) capacitance rate of change (%) 50 v torelance 16 v torelance 10 v torelance 50 v torelance 16 v torelance 10 v torelance fig. 26 capacitance vs bias (y5v) fig.27 capacitance vs bias (x5r, x7r) fig. 28 capacitance vs temperature (x5r, x7r, y5v) fig. 24 board: 7 mm ? 7 mm ? 0.8 mm material: glass epoxy pcb 0 0.2 0.4 0.6 0 25 50 75 100 125 ta[ ] pd[w] 530 mw cin: 1.0 f co: 1.0 f thermal protection over current protection voltage reference control block b1 a1 b2 a2 cin vout co vin vin gnd vstby vout stby a b 2 1 top view (mark side) 1pin mark bh rb1wgut 0 20 40 60 80 100 120 -25 0 25 50 75 temp[ ] [%] y5v x7r x5r capacitance rate of change (%) capacitance rate of change (%) ca p acitance rate of chan g e ( % )
bh rb1wgut series technical note 6/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. output capacitors mounting input capacitor between input pin and gnd (as close to pin as possible), and also output capacitor between output pin and gnd(as close to pin as possible) is recommended. t he input capacitor reduces the out put impedance of the voltage supply source connected to the vcc. t he higher value the output capacitor goes the more stable the whole operation becomes. this leads to high load transient response. please confirm the whole operation on actual application board. generally, ceramic capacitor has wide range of tolerance, temperat ure coefficient, and dc bias c haracteristic. and also its val ue goes lower as time progresses. please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers. bh rb1wgut operation notes 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 3. inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pins are shorted together. 4. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit (tsd circ uit). the thermal shutdown circuit is designed only to shut the ic off to prevent runaway thermal operation. it is not de signed to protect the ic or g uarantee its operation. do not continue to use the ic after operating this circuit or use t he ic in an environment where the operation of this circuit is assumed. 5. overcurrent protection circuit the ic incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. this circuit serves to protect the ic from damage when the load is shorted. the protection circui t is designed to limit current flow by not latching in the event of a large and instantaneous current flow origi nating from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications charac terized by the continuous operation or transitioning of the protection circuits. at the time of the rmal designing, keep in mind that the current capability has negative characteristics to temperatures. 6. actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. 7. ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 8. influence of strong light exposure of the ic to strong light sources such as infrared light from a halogen lamp may cause the ic to malfunction. when it is necessary to use the ic in such environments, implement measures to block exposure to light from the light source. during testing, exposure to neither fluorescent lighting nor white leds had a significant effect on the ic. fig. 29 stable operating region characteristics (example) 0.01 0.1 1 10 100 0 50 100 150 i out [ma] esr[ ] stable region c out = 1.0 f ta = +25c output current iout [ma]
bh rb1wgut series technical note 7/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. 9. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 10. back current in applications where the ic may be exposed to back current fl ow, it is recommended to create a path to dissipate this current by inserting a bypass diode between the vin and vout pins. 11. testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 12. regarding input pin of the ic (fig.31) this monolithic ic contains p+ isolation and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers wi th the n layers of other elem ents, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. fig. 30 example bypass diode connection fig. 31 example of ic structure vin stby gnd out back current resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element
bh rb1wgut series technical note 8/8 www.rohm.com 2011.01 - rev.c ? 2011 rohm co., ltd. all rights reserved. ordering part number b h 1 5 r b 1 w g u t - e 2 part no. output voltage 15: 1.5 v 18: 1.8 v 25: 2.5 v 28: 2.8 v 29: 2.9 v 30: 3.0 v 31: 3.1 v 33: 3.3 v series rb1 : high ripple rejection shutdown switch w : includes switch package gut: vcsp60n1 packaging and forming specification e2: embossed tape and reel tape quantity direction of feed embossed carrier tape 3000pcs e2 (the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand.) reel 1pin 1234 1234 1234 1234 1234 1234 (unit:mm) vcsp60n1 direction of feed when you order , please order in times the amount of package quantity. 1pin mark a b s ba 0.05 s 0.08 0.5 0.250.1 1.040.1 0.210.05 0.270.1 0.5 0.60.075 1.000.1 4-0.30.05 a 12 b
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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